JCET Group Co: Revenue up 14.78% but net profit down 11.39% amid margin pressure and ramp-up costs

SHANGHAI, Oct. 23, 2025 /PRNewswire/ — Today, JCET Group , a leading global provider of integrated circuit (IC) back-end manufacturing and technology services, released its financial results for the third quarter of 2025. JCET reported record Q3 revenue of RMB 10.06 billion, up 8.6% quarter-on-quarter, marking the highest third-quarter revenue in the company's history. Net profit attributable to shareholders reached RMB 480 million, an increase of 80.6% from the previous quarter, while profit before tax (PBT) was up 29.3% year-on-year to RMB 610 million.

For the first nine months of 2025, JCET generated RMB 28.67 billion in revenue, up 14.8% year-on-year, setting a new record for the same period. Net profit attributable to shareholders totaled RMB 950 million.

In 2025, JCET accelerated efforts to upgrade advanced packaging capabilities and expand production capacity, while driving application-focused innovation and strengthening both global and local customer engagement. As a result, capacity utilization rose steadily from Q1 to Q3, reaching near-full levels across key product lines, including wafer-level packaging, power device packaging, and power management chip packaging.

Several business segments delivered strong year-on-year revenue growth in Q3 YTD 2025. Revenue from computing electronics, industrial and medical electronics, and automotive electronics rose by 69.5%, 40.7% and 31.3%, respectively. JCET's transformation continues to be driven by investment in high value-added areas, new product ramp-ups, and the expansion of mass production. With demand rebounding and utilization rates rising, the company plans to further optimize its product mix, prioritize capacity for high-margin products, and enhance overall profitability.

In the first three quarters of 2025, JCET significantly increased its R&D investment, with expenses rising 24.7% year-on-year to RMB 1.54 billion. The company achieved breakthrough progress in several critical technology areas, including co-packaged optics (CPO), glass substrates, large-format fcBGA packaging, and high-density system-in-package (SiP) solutions. In parallel, JCET continues to attract top global talent and strengthen its R&D capabilities, further solidifying the foundation for long-term innovation and sustainable growth.

For more information, please refer to the JCET Q3 2025 Report.

About JCET Group

JCET Group is a global leader in integrated circuit back-end manufacturing and technology services. We provide comprehensive turnkey solutions, including semiconductor package integration design, wafer probing, bumping, assembly, final testing, and global drop shipments.

Utilizing advanced wafer-level packaging, 2.5D/3D packaging, System-in-Package solutions, and reliable flip chip and wire bonding technologies, we support a wide range of applications, including automotive, artificial intelligence, high-performance computing, storage, communication, smart devices, industrial and medical sectors, and power and energy. With cutting-edge R&D centers in China and Korea, and manufacturing facilities across China, Korea, and Singapore, we deliver efficient supply chain solutions and maintain close collaboration with our global customers.

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SOURCE JCET Group

Breakthrough yield and device performance at high volume show team can scale company's large-format advanced packaging for customers' cutting-edge applications

SINGAPORE, SG / ACCESS Newswire / October 15, 2025 / Silicon Box, a global leader in chiplet integration and advanced semiconductor packaging, announced it has shipped 100-million-units from its flagship factory in Singapore's Tampines Wafer Park. The state-of-the-art facility, which began mass production in late 2023, produces advanced panel-level packaging (PLP) exclusively and is the largest of its kind globally in terms of production capacity. Silicon Box's proprietary technology is able to support chiplet integration by addressing challenges in performance, scalability and costs in wafer-level and traditional packaging schemes.

"Achieving breakthrough results in production at high volume is a significant milestone for Silicon Box, as well as for transitioning the industry towards more scalable and low-cost design and manufacturing schemes - such as panel-level packaging and chiplet adoption - especially to meet the growing demand for larger, more powerful devices for future technologies," said Mike Han, Head of Business at Silicon Box.

"This achievement would not have been possible without our team's proven track record in R&D and execution, as well as our close collaboration with customers, which allowed us to challenge conventional methods and deliver cutting-edge solutions at low cost and high performance, at scale."

Record Breaking Yield and Factory Progress

One of the more remarkable aspects of Silicon Box's 100-million-unit shipment milestone, is that the production facility has exceeded co-founder and CEO, Dr. BJ Han, and his technical leadership team's long term track record for industry leading yield which was 99.7% at wafer scale.

"Silicon Box is proud to announce that this shipment milestone demonstrates our team's capability to execute advanced panel level packaging at high volume, but more importantly at very high yield," shared JH Yee, Head of Operations at Silicon Box. "Our founding team in operations and technology, including myself, have been working under Dr. BJ Han's leadership over multiple decades, at multiple semiconductor packaging companies. We are breaking our own record for production yield at panel scale, right now, while producing millions of units a day. This proves this execution capability always belonged to this team and lives on at Silicon Box."

The Tampines factory had its grand opening in July 2023, with mass production starting later that year. In 2024, the facility achieved ISO 9001:2015 certification, followed by ISO 14001:2015 and ISO 45001:2018 certifications in 2025. These certifications underscore Silicon Box's commitment to quality and customer satisfaction, employee well-being and sustainability management, respectively.

Expansion of Manufacturing Capacity on Track

Silicon Box's 100-million-unit production milestone demonstrates that the company is on track to achieve its capacity and production targets at its flagship facility, with full capacity installation expected by 2028.

Meanwhile, the company's second manufacturing facility, to be located in Novara, Piedmont, Italy, is expected to begin production in 2028. The planned site which is larger than Singapore is expected to replicate production capacity and bring native test capability to Europe. The new plant will establish a full semiconductor value chain from design to final manufacturing and test, to serve sectors such as artificial intelligence (AI), high-performance computing (HPC), automotive, mobile, Internet of Things, and robotics.

"As the only independent semiconductor packaging company possessing the current capability to enable chiplet architectures with high interconnection density at panel scale in mass production, our collaborations are yielding industry leading results for early customers at a low cost especially in advanced automotive, robotics, high-performance computing and AI applications," said Mike Han.

"At the same time, the benefits of our solutions and the economics of our large-format manufacturing scheme allow a broader range of customers and device applications to reap the benefits of the most advanced packaging methods. These same customers and applications might find that the cost is prohibitive and capacity hard to come by with other providers."

About Silicon box

Silicon Box is an advanced semiconductor packaging company, specializing in cutting-edge integration technology and manufacturing processes. We offer solutions that enable chiplet architecture, as well as high performance, affordable alternatives to traditional packaging schemes. Leveraging our proprietary technology, 30 years of multi-sectoral expertise, and relationships with best-in-class partners, we strive to solve the unique challenges of chiplet adoption to build the emergent technologies shaping the world around us today.

Silicon Box was founded in 2021 by Dr. Byung Joon (BJ) Han, Dr. Sehat Sutardja, and Weili Dai. Dr. Han was previously the Chairman, CEO and CTO of the world's 3rd largest outsourced assembly and test provider, STATS ChipPAC for two decades, taking the company to $4B in revenue during his tenure. Dr. Han is the inventor of many of the most advanced packaging solutions in today's market, and his team at Silicon Box holds standing records for yield in advanced packaging technology at wafer-level production. Dr. Sutardja introduced the concept of chiplets at the International Solid State Circuits Conference (ISSCC) in 2015. He and Weili Dai founded Marvell Technology Group in 1995 and ran the company for twenty years from a start-up to an over $50B market value company. To learn more about Silicon Box go to: silicon-box.com/newsroom and silicon-box.com/timeline.

Forward-Looking Statements:

This report contains forward-looking statements that involve a number of risks and uncertainties. Such statements include: our manufacturing expansion and investment plans and expectations in the European Union (EU) and the anticipated benefits therefrom; anticipated supplier, ecosystem, community, and government support and approval for our planned EU investments and anticipated benefits related to such support; environmental plans for and benefits from our factories and technologies; and other characterizations of future plans, expectations, events, or circumstances. Such statements involve risks and uncertainties that could cause our actual results to differ materially from those expressed or implied, including: changes in demand for our products; Silicon Box's failure to realize the anticipated benefits of its strategy, plans, and proposed transactions; construction delays or changes in plans due to business, economic, or other factors; increases in capital requirements and changes in capital investment plans; adverse changes in anticipated government incentives and associated approval related to Silicon Box's planned EU investments; adverse legislative or other government actions; insufficient ecosystem support; the impact of macroeconomic and geopolitical trends and events; and other risks and uncertainties described in this press release. All information in this press release reflects management's views as of the date hereof unless an earlier date is specified. We do not undertake, and expressly disclaim any duty, to update such statements, whether as a result of new information, new developments, or otherwise, except to the extent that disclosure may be required by law.

### End of Release ###

Contact us

Press: janice.yeo@silicon-box.com

Investors: mike.han@silicon-box.com

SOURCE: Silicon Box

View the original press release on ACCESS Newswire

Revenue grew 20.1% year-over-year to RMB 18.61 billion, with strong gains in automotive and industrial/medical segments, but net profit fell 24% due to higher costs and new plant ramp-up. The company remains a global OSAT leader and is expanding advanced packaging and automotive capacity.

Original document: JCET Group Co., Ltd. Class A [600584] Interim report — Aug. 21 2025

SHANGHAI, Aug. 20, 2025 /PRNewswire/ — JCET Group , a leading global provider of integrated circuit (IC) back-end manufacturing and technology services, today announced its financial results for the first half of 2025. According to its interim report, the company achieved revenue of RMB 18.61 billion for H1 2025, up 20.1% year-on-year. Q2 2025 revenue reached RMB 9.27 billion, up 7.2% year-on-year. Both figures represent record highs for the respective periods. Net profit attributable to owners of the parent for the first half of 2025 was RMB 470 million, with the second quarter contributing RMB 270 million.

During the reporting period, JCET saw a significant increase in overall capacity utilization compared to the same period last year. The company further optimized its global manufacturing footprint and supply chain systems, while continuing to improve its lean production capabilities and quality management standards. Strong inventory control ensured high operational efficiency, contributing to solid operating net cash flow.

Leveraging emerging market opportunities in edge intelligence, autonomous driving, and high-density storage, JCET achieved year-on-year revenue increases of 72.1%, 38.6%, and 34.2% in computing electronics, industrial and medical electronics, and automotive electronics, respectively. These results reflect the company's strategic foresight and its steady realization of value from forward-looking initiatives. In the first half of 2025, JCET significantly increased its investment in advanced packaging technologies and production capacity. While this exerted short-term pressure on net profit, it aligns with the company's long-term strategy of driving innovation through application-centric development to meet evolving market demands.

The company also intensified R&D efforts in key areas such as advanced packaging technology upgrades and mainstream package advancements. Total R&D expenditure reached RMB 990 million, marking a 20.5% increase year-on-year.

The automotive back-end manufacturing base of JCET Shanghai Automotive Co., Ltd. has completed construction and is scheduled to begin operations in the second half of this year. In addition, the company established a wholly-owned subsidiary, JCET (Jiangyin) Co., Ltd., to focus on System-in-Package (SiP) technologies and intelligent manufacturing. Since its commissioning last year, JCET Microelectronics (Jiangyin) Co., Ltd. has steadily ramped up production, providing customers with turnkey microsystem integration solutions. JCET will continue to accelerate breakthroughs and applications in next-generation advanced packaging technologies.

Mr. Li Zheng, CEO of JCET Group, said, "With a steady and progressive approach to sustainable development, JCET has delivered outstanding performance in the first half of 2025, achieving record revenue across both quarters. In the face of intertwined opportunities and challenges, we remain committed to optimizing our strategic positioning and building a solid foundation for long-term, high-quality growth."

For more information, please refer to the JCET Q2 2025 Report

About JCET Group

JCET Group is the world's leading integrated circuit back-end manufacturing and technology services provider. We offer a full range of turnkey solutions, including semiconductor package integration design and characterization, R&D, wafer probing, bumping, package assembly, final testing, and drop shipment to vendors worldwide.

Our comprehensive portfolio spans a broad range of semiconductor applications--including mobile, communications, computing, consumer, automotive, and industrial--delivered through advanced wafer-level packaging, 2.5D/3D packaging, System-in-Package solutions, and reliable flip chip and wire bonding technologies.

JCET Group has two R&D centers in China and Korea; eight manufacturing sites across China, Korea, and Singapore; and sales centers around the world, enabling close technology collaboration and efficient supply chain manufacturing for our global customers.

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SOURCE JCET Group

China and the U.S. rolling back tariffs should inject positive sentiment into Hong Kong and Chinese equities, Citi Research analysts say. While the reductions will last for 90 days, bilateral discussions will continue, Pierre Lau and others write in a note. Citi flags communications infrastructure, tech hardware, solar equipment, and semiconductors as the sectors that are most sensitive to tariffs. Among the firms with the largest profit mix generated from the U.S. are: Innolight, Eoptolink, TFC Optical, Tongfu, JCET, Jinko and JA Solar. Citi prefer H- to A-shares on a 12-month basis, assuming more rate cuts in the U.S.--benefitting HKD-- than in China. It is overweight on internet, tech and consumer sectors, with top picks including Tencent, Huaneng Power, Trip.com, BYD, AIA, Atour and Anta.(fabiana.negrinochoa@wsj.com)

JCET's attributable profit rose 50% to 203.4 million yuan in the first quarter from 135.2 million yuan in the year-ago period, according to a Tuesday filing with the Shanghai bourse.

Earnings per share at the integrated circuit manufacturer increased to 0.11 yuan from 0.08 yuan in the year-ago period.

Operating income grew 36% to 9.34 billion yuan from 6.84 billion yuan in the prior-year period.